Company:
Apolis
Location: Everett
Closing Date: 19/10/2024
Hours: Full Time
Type: Permanent
Job Requirements / Description
Position Title: Hardware Engineer
Position Type: Contract
Location: Everett WA
Duration: 12+ Months
Pay Rate Range: $56/hr W2
Experience:7+ year
CW will work onsite from day one at Seattle, WA
Must have/Primary skills: Circuit Design, Bring-up, Debug, Protocols, NPI, PCB design, Altium/Cadence design, Schematic capture, PCB layout
Candidate responsibilities
Partner with Design, Engineering and Research teams to identify and solve complex design and technological challenges.
Specifying components, building schematics, completing board layouts, assembling, testing, debugging, and integrating designs into opto-electro-mechanical systems
Collaborating in a team environment with cross-functional teams such system engineering, architecture, product design, , NPI and research. PCB design, Multi-Layer (NXP, TI, Qualcomm)
Transforming vendor and internal reference designs into custom solutions
Ability to execute multiple streams of work simultaneously and independently balance and prioritize project workload to ensure success against timeline constraints
What You'll Be Doing:
4+ years of experience with system-level electrical design including circuit design, system bring-
up, integration, and debug
Experience in several of the following topics: low-power circuit design, DC/DC converters, power management methods, audio circuit design, high speed signals, and analog design
Experience with microcontrollers, microprocessor digital circuit design and various
communications protocols such as I2C, UART, SPI, USB, MIPI CSI/DSI, I2S, LPDDR, SDIO etc.
Experience with mixed-signal board-level design
Hands-on experience with debugging and related equipment (Oscilloscope, Multimeters, Logic Analyzers, etc.).
Strong collaborator, excellent communication skills with experience with cross-team and cross- geography collaboration
Experience with design development from schematic capture, PCB layout through assembly
Experience with Altium or Cadence design tools.
What We Are Looking For:
7+ years of end-to-end integrated product development experience, including early-stage conceptual design, detailed design for manufacturing and assembly, late-stage mass production experience, overseas manufacturing and assembly
Experience leading a multidisciplinary product engineering team, with oversight into mechanical, electrical, and firmware workstreams and integration between disciplines
Systems-level engineering experience with complex integrated electromechanical assemblies
Experience integrating RF technologies such as WIFI, BT, GPS, etc
Experience with cameras and optical systems
Experience leading and driving design development from schematic capture, PCB layout through.
Experience:7+ year
CW will work onsite from day one at Seattle, WA
Must have/Primary skills: Circuit Design, Bring-up, Debug, Protocols, NPI, PCB design, Altium/Cadence design, Schematic capture, PCB layout
Candidate responsibilities
Partner with Design, Engineering and Research teams to identify and solve complex design and technological challenges.
Specifying components, building schematics, completing board layouts, assembling, testing, debugging, and integrating designs into opto-electro-mechanical systems
Collaborating in a team environment with cross-functional teams such system engineering, architecture, product design, , NPI and research. PCB design, Multi-Layer (NXP, TI, Qualcomm)
Transforming vendor and internal reference designs into custom solutions
Ability to execute multiple streams of work simultaneously and independently balance and prioritize project workload to ensure success against timeline constraints
What You'll Be Doing:
4+ years of experience with system-level electrical design including circuit design, system bring-
up, integration, and debug
Experience in several of the following topics: low-power circuit design, DC/DC converters, power management methods, audio circuit design, high speed signals, and analog design
Experience with microcontrollers, microprocessor digital circuit design and various
communications protocols such as I2C, UART, SPI, USB, MIPI CSI/DSI, I2S, LPDDR, SDIO etc.
Experience with mixed-signal board-level design
Hands-on experience with debugging and related equipment (Oscilloscope, Multimeters, Logic Analyzers, etc.).
Strong collaborator, excellent communication skills with experience with cross-team and cross- geography collaboration
Experience with design development from schematic capture, PCB layout through assembly
Experience with Altium or Cadence design tools.
What We Are Looking For:
7+ years of end-to-end integrated product development experience, including early-stage conceptual design, detailed design for manufacturing and assembly, late-stage mass production experience, overseas manufacturing and assembly
Experience leading a multidisciplinary product engineering team, with oversight into mechanical, electrical, and firmware workstreams and integration between disciplines
Systems-level engineering experience with complex integrated electromechanical assemblies
Experience integrating RF technologies such as WIFI, BT, GPS, etc
Experience with cameras and optical systems
Experience leading and driving design development from schematic capture, PCB layout through.
Position Type: Contract
Location: Everett WA
Duration: 12+ Months
Pay Rate Range: $56/hr W2
Experience:7+ year
CW will work onsite from day one at Seattle, WA
Must have/Primary skills: Circuit Design, Bring-up, Debug, Protocols, NPI, PCB design, Altium/Cadence design, Schematic capture, PCB layout
Candidate responsibilities
Partner with Design, Engineering and Research teams to identify and solve complex design and technological challenges.
Specifying components, building schematics, completing board layouts, assembling, testing, debugging, and integrating designs into opto-electro-mechanical systems
Collaborating in a team environment with cross-functional teams such system engineering, architecture, product design, , NPI and research. PCB design, Multi-Layer (NXP, TI, Qualcomm)
Transforming vendor and internal reference designs into custom solutions
Ability to execute multiple streams of work simultaneously and independently balance and prioritize project workload to ensure success against timeline constraints
What You'll Be Doing:
4+ years of experience with system-level electrical design including circuit design, system bring-
up, integration, and debug
Experience in several of the following topics: low-power circuit design, DC/DC converters, power management methods, audio circuit design, high speed signals, and analog design
Experience with microcontrollers, microprocessor digital circuit design and various
communications protocols such as I2C, UART, SPI, USB, MIPI CSI/DSI, I2S, LPDDR, SDIO etc.
Experience with mixed-signal board-level design
Hands-on experience with debugging and related equipment (Oscilloscope, Multimeters, Logic Analyzers, etc.).
Strong collaborator, excellent communication skills with experience with cross-team and cross- geography collaboration
Experience with design development from schematic capture, PCB layout through assembly
Experience with Altium or Cadence design tools.
What We Are Looking For:
7+ years of end-to-end integrated product development experience, including early-stage conceptual design, detailed design for manufacturing and assembly, late-stage mass production experience, overseas manufacturing and assembly
Experience leading a multidisciplinary product engineering team, with oversight into mechanical, electrical, and firmware workstreams and integration between disciplines
Systems-level engineering experience with complex integrated electromechanical assemblies
Experience integrating RF technologies such as WIFI, BT, GPS, etc
Experience with cameras and optical systems
Experience leading and driving design development from schematic capture, PCB layout through.
Experience:7+ year
CW will work onsite from day one at Seattle, WA
Must have/Primary skills: Circuit Design, Bring-up, Debug, Protocols, NPI, PCB design, Altium/Cadence design, Schematic capture, PCB layout
Candidate responsibilities
Partner with Design, Engineering and Research teams to identify and solve complex design and technological challenges.
Specifying components, building schematics, completing board layouts, assembling, testing, debugging, and integrating designs into opto-electro-mechanical systems
Collaborating in a team environment with cross-functional teams such system engineering, architecture, product design, , NPI and research. PCB design, Multi-Layer (NXP, TI, Qualcomm)
Transforming vendor and internal reference designs into custom solutions
Ability to execute multiple streams of work simultaneously and independently balance and prioritize project workload to ensure success against timeline constraints
What You'll Be Doing:
4+ years of experience with system-level electrical design including circuit design, system bring-
up, integration, and debug
Experience in several of the following topics: low-power circuit design, DC/DC converters, power management methods, audio circuit design, high speed signals, and analog design
Experience with microcontrollers, microprocessor digital circuit design and various
communications protocols such as I2C, UART, SPI, USB, MIPI CSI/DSI, I2S, LPDDR, SDIO etc.
Experience with mixed-signal board-level design
Hands-on experience with debugging and related equipment (Oscilloscope, Multimeters, Logic Analyzers, etc.).
Strong collaborator, excellent communication skills with experience with cross-team and cross- geography collaboration
Experience with design development from schematic capture, PCB layout through assembly
Experience with Altium or Cadence design tools.
What We Are Looking For:
7+ years of end-to-end integrated product development experience, including early-stage conceptual design, detailed design for manufacturing and assembly, late-stage mass production experience, overseas manufacturing and assembly
Experience leading a multidisciplinary product engineering team, with oversight into mechanical, electrical, and firmware workstreams and integration between disciplines
Systems-level engineering experience with complex integrated electromechanical assemblies
Experience integrating RF technologies such as WIFI, BT, GPS, etc
Experience with cameras and optical systems
Experience leading and driving design development from schematic capture, PCB layout through.
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